The USB 3.0 Promoter Group on Wednesday announced the completion of the USB 3.1 Specification which adds enhancements to enable SuperSpeed USB to operate at up to 10 Gbps. This latest release of the specification will be available immediately for download from the USB Implementers Forum (USB-IF) website.
SuperSpeed USB 10 Gbps uses a more efficient data encoding and will deliver more than twice the effective data through-put performance of existing SuperSpeed USB over enhanced, fully backward compatible USB connectors and cables. Compatibility is assured with existing USB 3.0 software stacks and device class protocols as well as with existing 5 Gbps hubs and devices and USB 2.0 products.
Developers interested in implementing the new USB 3.1 Specification have the opportunity to learn technical details during three developer conferences currently being planned. The international conferences planned in Europe and Asia will offer more advanced system design training as breakout sessions on the second day. For more details and conference registration instructions, please visit the USB-IF website.
The USB 3.1 specification primarily extends existing USB 3.0 protocol and hub operation for speed scaling along with defining the next higher physical layer speed as 10 Gbps, said Brad Saunders, USB 3.0 Promoter Group Chairman. The specification team worked hard to make sure that the changes made to support higher speeds were limited and remained consistent with existing USB 3.0 architecture to ease product development.
“We recognize this advancement in USB technology is an important development for our customers,” says Tom Bonola, Chief Technology Officer, Business PC Solutions, HP. “The USB 3.1 Specification enables us to meet the growing needs of our customers for faster data transfer while maintaining backwards compatibility with existing devices.”
“The industry has affirmed the strong demand for higher through-put, for user-connected peripherals and docks, by coming together to produce a quality SuperSpeed USB 10 Gbps specification,” says Alex Peleg, Vice President, Intel Architecture Group. “Intel is fully committed to deliver on this request.”
“While maintaining backward compatibility, USB continues to advance to meet customers growing need for higher speed data,” says Roland Sperlich, TI Consumer and Computing Interface Product Line Manager. “The 10 Gbps data rate allows designers across many industries to do more with a universal standard.”
“In this multi-device world, the USB 3.1 updates will enable end-users to move content across devices quickly, conveniently and without worrying about compatibility,” says Emile Ianni, Corporate Vice President of Platform Solutions Engineering, AMD. “AMD thanks our engineers as well as the other technology contributors for bringing to market robust innovation that is designed to work seamlessly with new and existing solutions.”
The USB 3.0 Promoter Group, comprised of Hewlett-Packard Company, Intel Corporation, Microsoft Corporation, Renesas Electronics, ST-Ericsson and Texas Instruments, developed the USB 3.0 Specification that was released in November 2008. In addition to maintaining and enhancing this specification, the USB 3.0 Promoter Group develops specification addendums to extend or adapt its specifications to support more platform types or use cases where adopting USB 3.0 technology will be beneficial in delivering a more ubiquitous, richer user experience.
The non-profit USB Implementers Forum, Inc. was formed to provide a support organization and forum for the advancement and adoption of USB technology. The USB-IF facilitates the development of high-quality compatible USB devices through its logo and compliance program, and promotes the benefits of USB and the quality of products that have passed compliance testing. Further information, including postings of the most recent product and technology announcements, is available by visiting the USB-IF website at: