ARM And Apple iDevice Chip Supplier TSMC Announce 7nm FinFET Collaboration Agreement – Digitimes

Digitimes’ Chau-Chin Chang and Steve Shen report that ARM and Apple’s primary A-Series System-on-Chip (SoC) supplier Taiwan Semiconductor Manufacturing Company (TSMC) have announced a multi-year agreement to collaborate on a 7nm FinFET process technology. The ARM-TSMC deal includes a design solution for future low-power, high-performance SoCs, expands the companies’ long-standing partnership, and advances cutting-edge process technologies beyond mobile and into next-generation networks and data centers.

Chang and Shen quote TSMC R&D vice president Cliff Hou  observing that “Customers designing their next generation high-performance computing SoCs will benefit from TSMC’s industry-leading 7nm FinFET, which will deliver more performance improvement at the same power or lower power at the same performance as compared to our 10nm FinFET process node.”

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http://www.digitimes.com/news/a20160315PD208.html