Research and Markets Releases iPhone 6s Plus Rear Camera Module – Reverse Costing Analysis Report

A new analysis report from Dublin-based Research and Markets observes that with the iPhone 6s Plus, Apple introduced a new rear camera module. The new device has similar structure and technology than the one used in earlier iPhone models, but it has higher resolution and smaller pixel size.

The iPhone 6s Plus camera module integrates a 12Mpixel resolution CMOS Image Sensor, with aperture of f/2.2 and a pixel size of 1.22m. The smaller pixel size implies the introduction of Deep Trench Isolation structure.

With the iPhone 6 Plus, the logic ISP circuit with 45nm technology node process, the assembling structure and the 5-elements lens module are the same a before; otherwise technical ameliorations of the VCM yield a better quality of the autofocus and OIS functions.

The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process and uses technology from Sony (Exmor-RS), which consists in stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit.

The report also notes that with this device Apple has significantly modified part of the upstream supply chain.

The report includes comparisons with iPhone 5s and iPhone 6 Plus Rear Camera Module.

Key Topics Covered:

1. Introduction

2. Company Profile & Supply Chain

3. Physical Analysis
– Camera Module View & Dimensions
– Camera Module X-Ray
– Camera Module Disassembly
– CMOS Image Sensor
– View & Dimensions
– Pads, Tungsten Grid
– TSV Connections
– CIS Pixels
– Logic Circuit (Transistors, SRAM)
– Cross-Section: Camera Module Overview
– Driver (Assembly & Process) & MLCC
– Ceramic Substrate, IR Filter & FPC
– Lenses, Housing, VCM, IOS
– Cross-Section: CMOS Image Sensor Overview
– Pad Trenches
– Pixel Array Circuit
– Logic Circuit
– TSVs

4. Technology and Cost comparison with iPhone 5s and 6 Plus camera module

5. Manufacturing Process Flow
– Global Overview
– Logic Circuit Front-End Process
– Pixel Array Circuit Front-End Process
– BSI + TSV + Microlenses Process
– CIS Wafer Fabrication Unit

6. Cost Analysis
– Synthesis of the cost analysis
– Main steps of economic analysis
– Yields Hypotheses
– CMOS Image Sensor Cost
– Logic Circuit Front-End Cost
– Pixel Array Front-end Cost
– BSI , IOS & TSV Front-End Cost
– Color Filters & Microlenses Front-End Cost
– Total Front-End Cost
– Back-End: Tests & Dicing
– CIS Wafer and Die Cost
– Camera Module Assembly Cost
– Lens Module Cost
– VCM Actuator Cost
– Final Cost
– Camera Module Cost

For more information visit:
http://www.researchandmarkets.com
and:
http://www.researchandmarkets.com/research/d8n8qp/iphone_6s_plus

Source: Research and Markets

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