Apple Chip Foundry TSMC To Begin A11 System-on-Chip Volume Production In April – Digitimes

Digitimes’ Steve Shen is reporting today that according to the Chinese-language Economic Daily News (EDN), chipmaker and major Apple supplier foundery Taiwan Semiconductor Manufacturing Company (TSMC) will start volume production of Apple A11 systems-on-chip in April with capacity to ship 50 million units before July.

The A11 SoCs are expected to initially power the new iPhone 8 series, which, if Apple follows its customary product refresh timetable, should be released in September, and the EDN report says will be fabricated using TSMC’s 10 nm FinFET process and packed with a wafer-level integrated fan-out (InFO) packaging technology, which according to Applied Materials blogger David Lammers is “perhaps the biggest thing to hit the semiconductor industry since immersion lithography and high-k dielectrics.”

Digitimes’ Shen notes that TSMC started volume production of 10nm chips in Q3 2016, and that the EDN report cites TSMC co-CEO and president Mark Li affirming that the company has started shipping 10nm silicon to MediaTek and HiSilicon Technologies.

For the full Digitimes report, visit here:
http://www.digitimes.com/news/a20170327PB201.html

Source: Digitimes

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